“We want to explore new ways of putting incredibly tiny things together, with the goal of developing new miniaturization and assembly methods that would work at scales 100,000 times smaller than current state-of-the-art technology,” said <a href="http://www.darpa.mil/Our_Work/DSO/Personnel/Dr__John_Main.aspx">John Main</a>, DARPA program manager. “If successful, A2P could help enable creation of entirely new classes of materials that exhibit nanoscale properties at all scales. It could lead to the ability to miniaturize materials, processes and devices that can’t be miniaturized with current technology, as well as build three-dimensional products and systems at much smaller sizes.”<br><br><a href="http://www.darpa.mil/NewsEvents/Releases/2014/08/22.aspx">READ MORE ON DARPA</a>
