Integrated Water Cooling for Vacuum Chambers

05/06/2015 - 03:46

Perry Henderson

Vacuum process systems often involve thermal output, requiring chambers with integrated cooling options.  Some applications which commonly utilize water cooling include: Vacuum Deposition (CVD, MOCVD, PVD and IBAD), Crystal Growth/Pulling, Space Simulation, and Vacuum Furnaces.

For applications with very high heat loads, double chamber walls with baffles to promote good flow and circulation provide the most effective method of water cooling. 

For lower heat load systems, water traces or channels on the surface can suffice.  The design parameters, cost impact, and effective cooling all vary by configuration.
Hyrdro-formed channels offer a water-cooling option with approximately 2X the surface area being cooled over conventional ‘C’ channel style water cooling. The cooling channels are produced by welding a trace to a chamber, then using water pressure to form open paths for water flow. Radius bends instead of square corners improves water flow and eliminates low flow and stagnant areas. Full penetration welds at edges of the channels reduce the risks of cracks and corrosion, which extends the working life of the chamber.